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  Data Acquisition
  Capacitance sensors
 
 Proforma 300:

The Proforma 300 is based on MTI Instruments' proprietary capacitance technology and can be used on all wafer materials including:

  • Silicon

  • Gallium-Arsenide

  • Indium Phosphide

  • Germanium

... without recalibrating or electrically grounding the wafer!

  • Fast, Accurate, and Reliable, the Proforma 300 measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV)

  • Portable and Easy to Set Up, the Proforma 300 provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process.

Thickness and TTV values are obtained by placing the wafer between the non-contact capacitance probes. The Teflon coated wafer stage allows for easy, non-abrasive positioning of the wafer, while removable locating pins can be utilized for precise center thickness measurements. Thickness and TTV values are indicated on the high resolution LCD display.
 

Potable Tabletop Semiconductor Wafer Measurement   Menu-driven for Fast, Easy Setup.
Noncontact Capacitance Wafer Scanning Profiling   Proprietary Push-PullTM Probe Technology.
300mm Wafers 300 mm Wafers Measurements   High-resolution LCD Display.
Measuring Wafers   On-board Microprocessor for Accurate, Repeatable Measurements.
Silicon Germaium Gallium-Arsenide Indium-Phosphide   Bubble Level.
Si GaAs InP Ge SiC Wafer Profiling   Adjustable Stage for Precise Leveling.
12in 12inch 12 inches Diameter   Teflon Wafer Stage for Easy, Non-abrasive Positioning.

 

Measurements

 Thickness TTV 5-point Continuous Measuring    Thickness.
 Ungrounded no grounding no contact non-contact    Total Thickness Variation (TTV).
 Low cost Inexpensive    Continuous and 5-point Measurement.

Advantages

   Measures Different Materials, such as Si, Ge, InP, and GaAs,
 without Recalibration.
 High Precision Accurate Wafer Measurement  No Need to Electrically Ground the Wafer.
   Easy to Set up and Operate - making it ideal for Production 
 and Statistical Process Control (SPC).
   Provides High Performance at Low Cost.
   Can be Customized for Maximum Sensing Range or 
 Maximum Stand-off from Target.

Features

   MTI Instruments' Proprietary Capacitance Circuitry for
 Outstanding Accuracy and Dependability.
   Non-contact Measurements.
   50- 300 mm Diameter Wafer Range.
   +/-0.25 µm Accuracy.
   RS-232 Output Port to PC.
   Parallel Port for Printer


Specifications
:

Wafer size   50-300 mm (2-12")
Wafer thickness range 100 mm-1 mm (0.004" - 0.040")
Accuracy +/- 0.25 mm (+/-10 min)
Resolution    0.125 mm (5 min)
Repeatability                  

+/- 0.25 mm (+/-10 min)

Linearity  +/- 0.25 mm (+/-10 min)
Response Time 5 ms
Stability 0.125 mm/ ºC (5 min/ ºC)
Dimensions 19" L x 13" W x 11" H
Weight     13.5 kg (30 lb)
Power requirements  100/230 Vac; 50/60 Hz; 40 W
Operating environment   15-27 ºC (60-80 ºF)
Data output  LCD display; RS-232 port
Acceptable printers Dot matrix; Laser, Inkjet
Optional GPIB interface  
Optional Ethernet interface  

Toll Free: (888) 738-0039
E-mail: a-kast@on.aibn.com

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